Weeping Weeping is liquid descending through the tray perforations, short-circuiting the contact zone, which lowers tray efficiency. At the tray floor, liquid static head that acts to push liquid down the perforations is counteracted by the gas pressure drop that acts to hold the liquid on the tray. When the static head overcomes the gas pressure drop, weeping occurs.
Some weeping usually takes place under all conditions due to sloshing and oscillation of the tray liquid. Generally, this weeping is too small to appreciably affect tray efficiency. The weep point is the gas velocity at which weeping first becomes noticeable. At this point, little efficiency is lost. As gas velocity is reduced below the weep point, the weep rate increases. When the weep rate becomes large enough to significantly reduce tray efficiency, the lower tray operating limit is reached.
The main factor that affects weeping is the fractional hole area. The larger it is, the smaller the gas pressure drop and the greater the weeping tendency. Larger liquid rates and taller outlet weirs increase
Hole F-factor, Uh pG1/2, m/sVkg/m3
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